GLOBALFOUNDRIES Inc. GFS has been selected to operate two new semiconductor manufacturing facilities at its Malta, New York, campus under a U.S.-Japan investment initiative worth up to $21 billion. The expansion will increase the company’s U.S. production capacity and support demand for chips used in automotive, industrial, communications and data center applications.
Under the project, GlobalFoundries will use Japan’s initial investment of around $10 billion to build a new semiconductor manufacturing plant, which is expected to begin operations in 2029. An additional investment of approximately $10 billion could fund a second facility. Each plant is expected to add around 900,000 300mm wafers of annual production capacity. The project is expected to create approximately 27,000 construction and related jobs, along with more than 1,000 skilled manufacturing positions.
Separately, the company will reallocate $955 million from its existing U.S. government award to invest in silicon photonics, silicon-germanium and advanced packaging at its New York and Vermont facilities. These technologies are expected to support growing demand for artificial intelligence (AI), cloud data centers and high-speed communications.
The investment could strengthen GlobalFoundries’ position in the U.S. semiconductor market, support key customers such as Renesas, Apple, Cirrus Logic and General Motors, and enhance its role in the global semiconductor supply chain.
GlobalFoundries’ Peers
United Microelectronics Corporation UMC provides semiconductor foundry services for chips used in communications, automotive, consumer electronics and industrial applications. The company specializes in mature and specialty process technologies, including solutions for display drivers, power management and connectivity. UMC focuses on manufacturing reliability, process efficiency and long-term customer relationships to support demand for chips across a wide range of electronic devices.
Taiwan Semiconductor Manufacturing Company Limited TSM manufactures advanced semiconductors for leading global technology companies, supporting applications such as AI, high-performance computing and mobile devices. Its advanced process technologies help produce powerful, energy-efficient chips for smartphones, AI accelerators and high-performance computing systems. TSMC provides advanced packaging technologies that help improve chip performance and meet the growing computing demands of next-generation applications.
Marvell Technology, Inc. MRVL develops semiconductor solutions for data infrastructure, including AI systems, cloud computing and data centers. Its portfolio includes networking chips, optical connectivity solutions and custom silicon designed to support high-speed data transfer and efficient computing. As AI workloads increase the need for faster connectivity and greater data processing capacity, Marvell is focusing on technologies that help cloud providers and enterprise customers build scalable, high-performance infrastructure.
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GlobalFoundries Inc. (GFS): Free Stock Analysis Report
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This article originally published on Zacks Investment Research (zacks.com).