ValeurQ4, 24Q1, 25Q2, 25Q3, 25Q4, 25Q1, 26TTMFrais de vente, généraux et administratifs34.04 M32.48 M31.31 M39.15 M45.63 M44.12 M160.21 MRecherche et développement27.65 M27.13 M27.06 M24.64 M30.13 M28.52 M110.35 MRésultat d'exploitation54.53 M29.16 M28.96 M25.02 M36.17 M7.95 M98.11 MTotal des produits hors exploitation4.11 M3.92 M6.03 M5.13 M3.85 M2.67 M17.68 MCharges d'intérêts, nettes des intérêts capitalisés1.44 M1.37 M1.35 M1.3 M1.34 M1.29 M5.29 MRésultat hors exploitation, hors charges d'intérêts4.83 M4.23 M2.77 M2.85 M2.26 M888 K8.78 MRevenus/dépenses exceptionnels-719 K-309 K1.91 M970 K247 K495 K3.62 MRésultat avant impôts58.65 M33.08 M35 M30.15 M40.02 M10.63 M115.79 MPart des actionnaires dans le résultat———————Impôts8.69 M4.5 M3.62 M4.16 M5.72 M1.41 M14.92 MIntérêts ne donnant pas le contrôle / intérêts minoritaires———————Autres produits/charges après impôts———————Résultat net avant activités abandonnées49.96 M28.58 M31.38 M25.99 M34.3 M9.21 M100.87 MActivités abandonnées———————Résultat net49.96 M28.58 M31.38 M25.99 M34.3 M9.21 M100.87 MAjustement de dilution———————Dividendes privilégiés———————Résultat net dilué revenant aux actionnaires ordinaires49.95 M28.58 M31.38 M25.99 M34.3 M9.21 M100.87 MBénéfice par action de base (BPA de base)1.540.890.990.831.10.33.22Bénéfice par action dilué (BPA dilué)1.540.880.980.831.110.33.22Nombre moyen d'actions de base en circulation32.55 M32.26 M31.85 M31.29 M31.57 M30.72 M—Nombre d'actions en circulation après dilution32.7 M32.34 M31.88 M31.45 M31.67 M30.98 M—EBITDA58.8 M33.47 M33.48 M29.35 M40.63 M12.39 M115.85 MEBIT54.53 M29.16 M28.96 M25.02 M36.17 M7.95 M98.11 MCoût des ventes136.19 M103.8 M107.2 M124.81 M126.4 M118.38 M476.78 MAutres coûts des ventes———————Amortissements (flux de trésorerie)4.27 M4.31 M4.51 M4.33 M4.46 M4.44 M17.74 M
Axcelis Technologies, Inc. - Common Stock
Axcelis Technologies, Inc. is an American company engaging in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. It produces ion implantation systems, including high and medium current implanters, and high energy implanters, and curing systems used in the fabrication of semiconductor chips. The company was incorporated in 1995 and is headquartered in Beverly, Massachusetts, United States.
In 2000, Eaton Corporation spun off its semiconductor manufacturing equipment business as Axcelis Technologies.
On December 4, 2012 Axcelis Technologies decided "...that it will exit the dry-strip business and divest its dry-strip intellectual property and technology, including the advanced non-oxidizing process technology of its Integra product line, to Lam Research, ...Axcelis will continue to ship its 300 mm dry-strip products through August 2013..."
In 2015, Axcelis sold its headquarters in a leaseback agreement.
In October 2025, Axcelis and Veeco agreed to merge in an all-stock transaction valued at approximately $4.4 billion, with Axcelis shareholders owning about 58% and Veeco shareholders about 42% of the combined company.